Recent results in high-precision surface ablation, film removal, ripple formation are presented. Volume processing via polymerization, marking, dicing, cutting, and drilling of semiconductor and dielectric materials are discussed. We focus on processes which can be carried out at a high throughput in the industrial environment or/and can deliver functionalities currently not amenable by competing technologies. Unique features of direct laser writing by femtosecond laser pulses are highlighted. Methodology for solutions of engineering tasks is presented. Namely, the laser irradiation parameters are selected on the basis of the required processing conditions for the material of a workpiece.

Keywords: solar cells, micro-optical elements, ripples, 3D polymerisation
PACS: 81.16.-c

APDIRBIMAS FEMTOSEKUNDINIU LAZERIU – NAUJA PERSPEKTYVI TECHNOLOGIJA
R. Buividas^a,b, M. Mikutis^c,d, T. Kudrius^c,d , A. Greičius^c, G. Šlekys^c, S. Juodkazis^a,b
aSvinberno technologijos universitetas, Hawthorn, Australija
^bMelburno nanotechnologijos centras, Clayton, Australija
^cUAB „Altechna“, Vilnius, Lietuva
^dVilniaus universiteto Lazerinių tyrimų centras, Vilnius, Lietuva

Pristatomi didelio tikslumo paviršiaus abliacijos, paviršinių sluoksnių pašalinimo ir raibulių formavimo rezultatai. Aptariamas tūrinis puslaidininkinių ir dielektrinių medžiagų apdirbimas polimerizacijos, ženklinimo, pjovimo ir gręžimo būdais.
Nagrinėti procesai, tinkami didelio našumo pramoninėms užduotims atlikti ir suteikti naujų savybių, kurių neįmanoma įgyvendinti kitomis šiuolaikinėmis konkuruojančiomis technologijomis. Aptariamos unikalios tiesioginio lazerinio fabrikavimo femtosekundiniais lazerio impulsais savybės. Pateikiamos inžinerinių uždavinių sprendimų metodikos. Lazerinės spinduliuotės parametrai yra parenkami atsižvelgiant į apdorojimo sąlygas, reikalingas konkrečiai medžiagai ar gaminiui.

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